HCMC — Danang City is looking for investors in a VND1.8-trillion semiconductor lab focused on advanced packaging technology as part of the city’s broader push into high-tech manufacturing.
Investor registration is open from May 10 to 24, 2025. The project will proceed under a process that allows simultaneous approval of investment and investor selection without public land auctions or bidding.
The proposed facility will be developed by VSAP Lab JSC on a 2,298-square-meter plot in Software Park No. 2 in Hai Chau District. It will support research and development in semiconductor packaging and artificial intelligence, according to an announcement on the city’s official portal (danang.gov.vn).
The lab is designed to produce up to 10 million units per year. It will also provide services such as product testing, installation, maintenance, consulting, training, and technical solutions.
The four-story building will have a total floor area of nearly 5,700 square meters. It will be equipped with supporting infrastructure including power supply, water systems, fire safety, telecommunications, air conditioning, and environmental controls.
The project will operate for 50 years, with construction scheduled to start in the second quarter of 2025 and finish by the fourth quarter of 2026.
