HCMC – Intel has handed over 31 chip assembly and testing devices to the Saigon Hi-Tech Park Training Center and Vietnam National University Hanoi, aiming to strengthen the country’s semiconductor workforce.
The equipment will be used to support training and research in the semiconductor sector in Vietnam, under a memorandum of understanding previously signed between Intel, the Saigon Hi-Tech Park Training Center, and Vietnam National University Hanoi.
The initiative provides hands-on experience with specialized equipment, helping bridge the gap between academic knowledge and industry practice, particularly in chip packaging and testing.
It also supports the Saigon Hi-Tech Park Training Center and Vietnam National University Hanoi in building end-to-end semiconductor training capabilities, from design to assembly and testing, while expanding applied learning and research opportunities for future engineers.
Kenneth Tse, vice president and general director of Intel Products Vietnam, said Vietnam is emerging as an important link in the global semiconductor value chain, with talent development remaining a top priority.
The donation, marking Intel’s 20 years in Vietnam, is intended to accelerate workforce readiness and support the country’s long-term ambitions in the semiconductor sector, he said.
